Package Materials Encapsulating Resin Materials Electrodes Materials Weight Ceramics （+） Silicone Resin (with diffuser and phosphor) Au-plated 1.2g(TYP) KA Protection Device 4 SOLDERING NICHIA STS-DA1-3056B
* Recomm.

NFCLL036B

NFCLL036B-M3

NFCLJ108B

NFCLJ108B-M2

NFCLJ108B-M3

NFC10-12D12

NFC10-12D15

NFC10-12S05

NFC10-12S12

NFC10-12S15

NFC10-24D12

NFC10-24D15

NFC10-24S05

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