* Pb-free Reflow Soldering Application
* ESD Withstand Voltage (HBM) Class 3B
* RoHS Compliant
* IATF 16.

Package Materials Encapsulating Resin Materials Electrodes Materials Weight Heat-Resistant Polymer （+） Silicone Resin (with diffuser and phosphor) + Au-plated Copper Alloy 0.0053g(TYP) * 。 Dimensions do not include mold flash or metal burr. .

NHS3100

NHS3152

NHSA046T

NHSA146AT

NHSA505DT

NHSB046AT

NHSB046T

NHSB046T-N3

NHSB046T-N5

NHSB046T-NA

NHSB064T

NHSB146AT

NHSG017HT