* Pb-free Reflow Soldering Application
* ESD Withstand Voltage (HBM) Class 3B
* RoHS Compliant
* IATF 16.

Package Materials Encapsulating Resin Materials Electrodes Materials Weight Heat-Resistant Polymer （+） Silicone Resin (with diffuser and phosphor) + Au-plated Copper Alloy 0.0050g(TYP) * 。 Dimensions do not include mold flash or metal burr. .

NSS1001CL

NSS12100M3T5G

NSS12100UW3TCG

NSS12100XV6T1G

NSS12200LT1G

NSS12200WT1G

NSS12500UW3T2G

NSS12600CF8T1G

NSS1C200L

NSS1C200LT1G

NSS1C200MZ4

NSS1C201LT1G

NSS1C201MZ4