Datasheet Details
| Part number | NVSA219BT |
|---|---|
| Manufacturer | NICHIA |
| File Size | 283.09 KB |
| Description | LED |
| Datasheet |
 NVSA219BT-NICHIA.pdf
|
| Part number | NVSA219BT |
|---|---|
| Manufacturer | NICHIA |
| File Size | 283.09 KB |
| Description | LED |
| Datasheet |
NVSA219BT-NICHIA.pdf
|
Package Materials Encapsulating Resin Materials Electrodes Materials Lens Materials Die Heat Sink Materials Weight Ceramics （） Silicone Resin (with phosphor) Au-plated Silicone Resin Au-plated 0.032g (TYP) KA Die Heat Sink Protection Device 4 0.4 1.2 1.9 3.3 0.5 SOLDERING Recommended Reflow Soldering Condition(Lead-free Solder) 1 to 5°C per sec Pre-heat 180 to 200°C 60sec Max Above 220°C 120sec Max 260°CMax 10sec Max Recommended Soldering Pad Pattern 0.5
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