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NVSU333A - UV LED

General Description

Ceramics Hard Glass Silicone Adhesive Au-plated Au-plated 0.26g(TYP) K A Die Heat Sink Protection Device 3 SOLDERING Recommended Reflow Soldering Condition(Lead-free Solder) 1 to 5°C per sec Pre-heat 180 to 200°C 60sec Max Above 220°C 120sec Max 260°CMax 10sec Max Rec

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Full PDF Text Transcription for NVSU333A (Reference)

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NICHIA STS-DA1-3115I <Cat.No.190206> NICHIA CORPORATION SPECIFICATIONS FOR UV LED NVSU333A(T) ● Pb-free Reflow Soldering Application ● Built-in ESD Protection Device ● Ro...

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ree Reflow Soldering Application ● Built-in ESD Protection Device ● RoHS Compliant SPECIFICATIONS NICHIA STS-DA1-3115I <Cat.No.190206> (1) Absolute Maximum Ratings Item Symbol Absolute Maximum Rating Forward Current IF 4500 Pulse Forward Current IFP 6000 Allowable Reverse Current IR 85 Power Dissipation PD 18.9 Operating Temperature Topr -10~85 Storage Temperature Tstg -40~100 Junction Temperature TJ 100 * Absolute Maximum Ratings at TS=25°C. * IFP conditions with pulse width ≤10ms and duty cycle ≤10%.

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