Description
PNP medium power transistor series encapsulated in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and visible and solderable side pads.
Features
- High collector current capability.
- Three current gain selections
IC and ICM.
- Reduced Printed-Circuit Board (PCB).
- Leadless very small SMD plastic
area requirements
package with medium power capability.
- Exposed heat sink for excellent thermal.
- Suitable for Automatic Optical
and electrical conductivity
Inspection (AOI) of solder joint.
- AEC-Q101 qualified
1.3.
BC51PAS-NXP.pdf
