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NXP Semiconductors Electronic Components Datasheet

MCF5329 Datasheet

Microprocessor

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Freescale Semiconductor
Data Sheet: Technical Data
MCF532x ColdFire®
Microprocessor Data Sheet
Features
• Version 3 ColdFire variable-length RISC processor core
• System debug support
• JTAG support for system level board testing
• On-chip memories
– 16-Kbyte unified write-back cache
– 32-Kbyte dual-ported SRAM on CPU internal bus,
accessible by core and non-core bus masters (e.g., DMA,
FEC, LCD controller, and USB host and OTG)
• Power management
• Liquid Crystal Display Controller (LCDC)
• Embedded Voice-over-IP (VoIP) system solution
• SDR/DDR SDRAM Controller
• Universal Serial Bus (USB) Host Controller
• Universal Serial Bus (USB) On-the-Go (OTG) controller
• Synchronous Serial Interface (SSI)
• Fast Ethernet Controller (FEC)
• Cryptography Hardware Accelerators
• FlexCAN Module
• Three Universal Asynchronous Receiver Transmitters
(UARTs)
• I2C Module
• Queued Serial Peripheral Interface (QSPI)
• Pulse Width Modulation (PWM) module
• Real Time Clock
• Four 32-bit DMA Timers
• Software Watchdog Timer
• Four Periodic Interrupt Timers (PITs)
• Phase Locked Loop (PLL)
• Interrupt Controllers (x2)
• DMA Controller
• FlexBus (External Interface)
• Chip Configuration Module (CCM)
• Reset Controller
• General Purpose I/O interface
Document Number: MCF5329DS
Rev. 5, 11/2008
MCF5329
MAPBGA–256
17mm x 17mm
MAPBGA–196
15mm x 15mm
© Freescale Semiconductor, Inc., 2008. All rights reserved.


NXP Semiconductors Electronic Components Datasheet

MCF5329 Datasheet

Microprocessor

No Preview Available !

Table of Contents
1 MCF532x Family Comparison . . . . . . . . . . . . . . . . . . . . . . . . .3
2 Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
3 Hardware Design Considerations . . . . . . . . . . . . . . . . . . . . . . .5
3.1 PLL Power Filtering. . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
3.2 USB Power Filtering . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
3.3 Supply Voltage Sequencing and Separation Cautions . .5
3.3.1 Power Up Sequence . . . . . . . . . . . . . . . . . . . . . .5
3.3.2 Power Down Sequence . . . . . . . . . . . . . . . . . . . .6
4 Pin Assignments and Reset States . . . . . . . . . . . . . . . . . . . . .6
4.1 Signal Multiplexing . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
4.2 Pinout—256 MAPBGA . . . . . . . . . . . . . . . . . . . . . . . . .14
4.3 Pinout—196 MAPBGA . . . . . . . . . . . . . . . . . . . . . . . . .15
5 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
5.1 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
5.2 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . .17
5.3 ESD Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
5.4 DC Electrical Specifications . . . . . . . . . . . . . . . . . . . . .18
5.5 Oscillator and PLL Electrical Characteristics . . . . . . . .19
5.6 External Interface Timing Characteristics . . . . . . . . . . .20
5.6.1 FlexBus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
5.7 SDRAM Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
5.7.1 SDR SDRAM AC Timing Characteristics. . . . . .23
5.7.2 DDR SDRAM AC Timing Characteristics . . . . . 25
5.8 General Purpose I/O Timing . . . . . . . . . . . . . . . . . . . . 28
5.9 Reset and Configuration Override Timing . . . . . . . . . . 29
5.10 LCD Controller Timing Specifications . . . . . . . . . . . . . 30
5.11 USB On-The-Go . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
5.12 ULPI Timing Specification . . . . . . . . . . . . . . . . . . . . . . 33
5.13 SSI Timing Specifications . . . . . . . . . . . . . . . . . . . . . . 33
5.14 I2C Input/Output Timing Specifications . . . . . . . . . . . . 35
5.15 Fast Ethernet AC Timing Specifications . . . . . . . . . . . 37
5.15.1 MII Receive Signal Timing . . . . . . . . . . . . . . . . 37
5.15.2 MII Transmit Signal Timing . . . . . . . . . . . . . . . . 37
5.15.3 MII Async Inputs Signal Timing . . . . . . . . . . . . 38
5.15.4 MII Serial Management Channel Timing . . . . . 38
5.16 32-Bit Timer Module Timing Specifications . . . . . . . . . 39
5.17 QSPI Electrical Specifications . . . . . . . . . . . . . . . . . . . 39
5.18 JTAG and Boundary Scan Timing . . . . . . . . . . . . . . . . 40
5.19 Debug AC Timing Specifications . . . . . . . . . . . . . . . . . 42
6 Current Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
7 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
7.1 Package Dimensions—256 MAPBGA . . . . . . . . . . . . . 45
7.2 Package Dimensions—196 MAPBGA . . . . . . . . . . . . . 46
8 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
MCF532x ColdFire® Microprocessor Data Sheet, Rev. 5
2 Freescale Semiconductor


Part Number MCF5329
Description Microprocessor
Maker NXP
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MCF5329 Datasheet PDF






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