NX2020P1 Key Features
- Trench MOSFET technology
- Small and leadless ultra thin SMD plastic package: 2 x 2 x 0.65 mm
- Exposed drain pad for excellent thermal conduction
- Tin-plated 100 % solderable side pads for optical solder inspection
- Part: NX2020P1
- Manufacturer: NXP Semiconductors (official site)
- Size: 263.74 KB
Related NXP Semiconductors Datasheets
| Part Number | Description |
|---|---|
| NX2020N2 | N-channel Trench MOSFET |
| NX20P0407 | CC and SBU Protection |
| NX20P0408 | USB D+/D- protection |
| NX20P0477 | USB Type-C CC smart protection |
| NX20P3483UK | high voltage sink/source combo switch |
NX2020P1 Description
P-channel enhancement mode Field-Effect Transistor (FET) in a leadless medium power DFN2020MD-6 (SOT1220) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.
NX2020P1 Applications
- Charging switch for portable devices
- DC-to-DC converters
- Power management in battery-driven portable devices