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NXP Semiconductors Electronic Components Datasheet

PUSB3FR6 Datasheet

ESD protection

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PUSB3FR6
ESD protection for ultra high-speed interfaces
Rev. 1 — 25 February 2015
Product data sheet
1. Product profile
1.1 General description
The device is designed to protect high-speed interfaces such as SuperSpeed and
Hi-Speed USB combination, SD-memory card 3.0 and thunderbolt interfaces against
ElectroStatic Discharge (ESD).
The device includes six high-level ESD protection diode structures for ultra high-speed
signal lines. The device is encapsulated in a leadless ultra small DFN2111-7 (SOT1358-1)
Surface-Mounted Device (SMD) plastic package.
All signal lines are protected by a special diode structure offering ultra low line
capacitance of only 0.35 pF. These diodes utilize a snap-back structure in order to provide
protection to downstream components from ESD voltages up to 15 kV contact exceeding
IEC 61000-4-2, level 4.
1.2 Features and benefits
System-level ESD protection for USB 2.0 and USB 3.1 combination, SD-memory card
and thunderbolt interfaces
Supports SuperSpeed USB 3.1 at 10 Gbps
All signal lines with integrated rail-to-rail clamping diodes for downstream
ESD protection of 15 kV exceeding IEC 61000-4-2, level 4
Matched 0.5 mm trace spacing
Line capacitance of only 0.35 pF for each channel
Design-friendly ‘pass-through’ signal routing
1.3 Applications
The device is designed for high-speed receiver and transmitter port protection:
Portable and wearable devices
Smartphones and tablet PCs
TVs and monitors
DVD recorders and players
Notebooks, main board graphic cards and ports
Set-top boxes and game consoles


NXP Semiconductors Electronic Components Datasheet

PUSB3FR6 Datasheet

ESD protection

No Preview Available !

NXP Semiconductors
PUSB3FR6
ESD protection for ultra high-speed interfaces
2. Pinning information
Table 1. Pinning
Pin Symbol
Description
1 CH1
channel 1 ESD protection
2 GND
ground
3 CH2
channel 2 ESD protection
4 CH3
channel 3 ESD protection
5 CH4
channel 4 ESD protection
6 CH5
channel 5 ESD protection
7 CH6
channel 6 ESD protection
Simplified outline Graphic symbol
134 567
1
7
22
6
3
5
4=
Transparent top view
aaa-016877
3. Ordering information
Table 2. Ordering information
Type number
Package
Name
PUSB3FR6
DFN2111-7
Description
Version
plastic extremely thin small outline package; SOT1358-1
no leads; 7 terminals; body 1.1 2.1 0.5 mm
4. Marking
Table 3. Marking codes
Type number
PUSB3FR6
Marking code
FR
5. Limiting values
PUSB3FR6
Product data sheet
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
VI
VESD
input voltage
electrostatic discharge
voltage
IEC 61000-4-2, level 4
contact discharge
0.5
[1]
15
air discharge
15
IPPM
Tamb
Tstg
rated peak pulse current
ambient temperature
storage temperature
tp = 8/20 s
7
40
55
[1] All pins to ground.
Max Unit
+3.3 V
+15
+15
7
+85
+125
kV
kV
A
C
C
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 25 February 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
2 of 12


Part Number PUSB3FR6
Description ESD protection
Maker NXP
Total Page 12 Pages
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