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PUSB3FR6 Datasheet Esd Protection

Manufacturer: NXP Semiconductors

Overview: XSON7 PUSB3FR6 ESD protection for ultra high-speed interfaces Rev. 1 — 25 February 2015 Product data sheet 1. Product profile 1.

General Description

The device is designed to protect high-speed interfaces such as SuperSpeed and Hi-Speed USB bination, SD-memory card 3.0 and thunderbolt interfaces against ElectroStatic Discharge (ESD).

The device includes six high-level ESD protection diode structures for ultra high-speed signal lines.

The device is encapsulated in a leadless ultra small DFN2111-7 (SOT1358-1) Surface-Mounted Device (SMD) plastic package.

Key Features

  • System-level ESD protection for USB 2.0 and USB 3.1 combination, SD-memory card and thunderbolt interfaces.
  • Supports SuperSpeed USB 3.1 at 10 Gbps.
  • All signal lines with integrated rail-to-rail clamping diodes for downstream ESD protection of 15 kV exceeding IEC 61000-4-2, level 4.
  • Matched 0.5 mm trace spacing.
  • Line capacitance of only 0.35 pF for each channel.
  • Design-friendly ‘pass-through’ signal routing 1.3.

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