Datasheet4U Logo Datasheet4U.com

PMEG6030ETP - Schottky barrier rectifier

General Description

Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package.

Key Features

  • Average forward current: IF(AV) ≤ 3 A.
  • Reverse voltage: VR ≤ 60 V.
  • Low forward voltage.
  • High power capability due to clip-bonding technology.
  • Small and flat lead SMD plastic package.
  • AEC-Q101 qualified.
  • High temperature Tj ≤ 175 °C 1.3.

📥 Download Datasheet

Datasheet Details

Part number PMEG6030ETP
Manufacturer NXP Semiconductors
File Size 264.69 KB
Description Schottky barrier rectifier
Datasheet download datasheet PMEG6030ETP Datasheet

📁 Similar Datasheet

Part Number Description Manufacturer
PMEG6030ETP Schottky barrier rectifier nexperia
PMEG6030ELP 3A low leakage current Schottky barrier rectifier NXP
PMEG6030ELP Schottky barrier rectifier nexperia
PMEG6030EP 60V 3A Schottky barrier rectifier nexperia
PMEG6030EVP Schottky barrier rectifier nexperia

Other Datasheets by NXP Semiconductors

Part Number Description
PMEG6030EP 3A low VF MEGA Schottky barrier rectifier
PMEG6030EVP Schottky barrier rectifier
PMEG6010CEH 1 A very low VF MEGA Schottky barrier rectifiers
PMEG6010CEJ 1 A very low VF MEGA Schottky barrier rectifiers
PMEG6010ETR Schottky barrier rectifier

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
PMEG6030ETP 15 October 2012 High-temperature 60 V, 3 A Schottky barrier rectifier Product data sheet 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package. 1.2 Features and benefits • Average forward current: IF(AV) ≤ 3 A • Reverse voltage: VR ≤ 60 V • Low forward voltage • High power capability due to clip-bonding technology • Small and flat lead SMD plastic package • AEC-Q101 qualified • High temperature Tj ≤ 175 °C 1.3 Applications • Low voltage rectification • High efficiency DC-to-DC conversion • Switch mode power supply • Reverse polarity protection http://www.