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SE97B Datasheet DDR memory module temp sensor

Manufacturer: NXP Semiconductors

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General Description

Meets JEDEC Specification 42.4 TSE2002B1, 3 Jun 2009.

The NXP Semiconductors SE97B measures temperature from −40 °C to +125 °C with JEDEC Grade B ±1 °C maximum accuracy between +75 °C and +95 °C critical zone and also provide 256 bytes of EEPROM memory communicating via the I2C-bus/SMBus.

It is typically mounted on a DDR3 Dual In-Line Memory Module (DIMM) measuring the DRAM temperature in accordance with the new JEDEC (JC-42.4) Mobile Platform Memory Module Temperature Sensor Component specification and also replacing the Serial Presence Detect (SPD) which is used to store memory module and vendor information.

Overview

SE97B Rev.

01 — 27 January 2010 www.DataSheet4U.com DDR memory module temp sensor with integrated SPD Product data sheet 1.

Key Features

  • SE97 old JEDEC specification no SMBus Timeout SMBus Timeout 25 ms to 35 ms 400 kHz VIL(max) = 0.3 × VDD; VIH(min) = 0.7 × VDD set to 0 frozen set to 0 yes set to 0 50 ns 1010 0010 0000 0001 Grade B 0.6 V 3.0 V to 3.6 V 3.0 V to 3.6 V 1.7 V to 3.6 V assembly plant Hong Kong 3.0 V to 3.6 V assembly plant Bangkok (thicker die and leadframe) 0000 0011 Improved Grade B 1.8 V 0.05 × VDD set to 1 set to 1 de-assert set to 1 SE97B new JEDEC specification SMBus Timeout 25 ms to 35 ms JEDEC specification.

More Datasheets from NXP Semiconductors

Part Number Description
SE97 DDR memory module temp sensor
SE95 Ultra high accuracy digital temperature sensor and thermal Watchdog
SE98 SO-DIMM SMBus/I2C-bus temperature sensor