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SE97 - DDR memory module temp sensor

General Description

The NXP Semiconductors SE97 measures temperature from

40 °C to +125 °C with JEDEC Grade B ±1 °C accuracy between +75 °C and +95 °C and also provide 256 bytes of EEPROM memory communicating via the I2C-bus/SMBus.

Key Features

  • 2.1 General features.
  • JEDEC (JC-42.4) TSE 2002B3 DIMM ± 0.5 °C (typ. ) between 75 °C and 95 °C temperature sensor plus 256-byte serial EEPROM for Serial Presence Detect (SPD).
  • Optimized for voltage range: 3.0 V to 3.6 V, but SPD can be read down to 1.7 V.
  • Shutdown current: 0.1 μA (typ. ) and 5.0 μA (max. ).
  • 2-wire interface: I2C-bus/SMBus compatible, 0 Hz to 400 kHz.
  • SMBus ALERT Response Address and.

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Full PDF Text Transcription for SE97 (Reference)

Note: Below is a high-fidelity text extraction (approx. 800 characters) for SE97. For precise diagrams, and layout, please refer to the original PDF.

SE97 Rev. 07 — 29 January 2010 www.DataSheet4U.com DDR memory module temp sensor with integrated SPD, 3.3 V Product data sheet 1. General description The NXP Semiconducto...

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, 3.3 V Product data sheet 1. General description The NXP Semiconductors SE97 measures temperature from −40 °C to +125 °C with JEDEC Grade B ±1 °C accuracy between +75 °C and +95 °C and also provide 256 bytes of EEPROM memory communicating via the I2C-bus/SMBus. It is typically mounted on a Dual In-line Memory Module (DIMM) measuring the DRAM temperature in accordance with the new JEDEC (JC-42.4) Mobile Platform Memory Module Temperature Sensor Component specification and also replacing the Serial Presence Detect (SPD) which is used to store memory module and vendor information. The SE97 thermal sensor operates over the VD

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