SE97B - DDR memory module temp sensor

Product Overview

NXP Semiconductors

Datasheet Details

Part number	SE97B
Manufacturer	NXP Semiconductors
File Size	453.81 KB
Description	DDR memory module temp sensor
Datasheet	SE97B Datasheet
Additional preview pages of the SE97B datasheet.

Product details

Description

Meets JEDEC Specification 42.4 TSE2002B1, 3 Jun 2009. 40 °C to +125 °C with JEDEC Grade B ±1 °C maximum accuracy between +75 °C and +95 °C critical zone and also provide 256 bytes of EEPROM memory communicating via the I2C-bus/SMBus.

Features

SE97 old JEDEC specification no SMBus Timeout SMBus Timeout 25 ms to 35 ms 400 kHz VIL(max) = 0.3 × VDD; VIH(min) = 0.7 × VDD set to 0 frozen set to 0 yes set to 0 50 ns 1010 0010 0000 0001 Grade B 0.6 V 3.0 V to 3.6 V 3.0 V to 3.6 V 1.7 V to 3.6 V assembly plant Hong Kong 3.0 V to 3.6 V assembly plant Bangkok (thicker die and leadframe) 0000 0011 Improved Grade B 1.8 V 0.05 × VDD set to 1 set to 1 de-assert set to 1 SE97B new JEDEC specification SMBus Timeout 25 ms to 35 ms JEDEC specification.

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Other Datasheets by NXP Semiconductors

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Published: Mar 18, 2010 |