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OSD3358 Datasheet C-sip Processor

Manufacturer: OCTAVO

Overview: OSD335x C-SiP Family Rev. 9 10/5/2022 Introduction The OSD335x C-SiP System-In-Package (SiP) is a self-contained computing system ideal to power the latest embedded applications. It integrates the powerful 1GHz Sitara™ ARM® Cortex®-A8 AM335x Processor from Texas Instruments, up to 1 Gigabyte (GB) of DDR3L memory, up to 16 Gigabytes (GB) of embedded Multimedia Card (eMMC) non-volatile memory, a low power, low jitter MEMs Oscillator, 4 Kilobytes (KB) EEPROM, TPS65217C PMIC, TL5209 LDO, and resistors, capacitors, and inductors into a single 27mm x 27mm easy to use IC package. With this level of integration, the OSD335x C-SiP has everything needed to build a complete embedded computing platform. It allows designers to focus on the key aspects of their system without spending time on the complications associated with getting the processing core working. It also reduces the overall size and complexity of the design while simplifying the supply chain. The OSD335x C-SiP can significantly decrease the time to market for any embedded computing products.

This datasheet includes multiple variants, all published together in a single manufacturer document.

Key Features

  • TI AM335x, TPS65217C, TL5209, DDR3, EEPROM, eMMC, MEMS Oscillator and passive components integrated into a single package.
  • TI AM335x Features: o ARM® Cortex®-A8 up to 1GHz o 8 channel 12-bit SAR ADC o Ethernet 10/100/1000 x 2 o USB 2.0 HS OTG + PHY x2 o MMC, SD and SDIO x3 o LCD Controller o SGX 3D Graphics Engine o PRU Subsystem OSD335x C-SiP Block Diagram.
  • Access to all.
  • AM335x Peripherals: CAN, SPI, UART, I2C, GPIO, etc.
  • Up to 1GB DDR3.
  • Up t.

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