• Part: OSD32MP157C
  • Description: Microprocessor
  • Manufacturer: OCTAVO
  • Size: 1.58 MB
OSD32MP157C Datasheet (PDF) Download
OCTAVO
OSD32MP157C

Overview

The OSD32MP15x System-in-Package (SiP) devices deliver all the power of a Microprocessor in a package that feels like a Microcontroller in the smallest possible footprint. At their core, the OSD32MP15x devices have the versatile STMicroelectronics STM32MP15x featuring Dual Arm® Cortex® A7 Cores and an Arm® Cortex® M4.

  • ST STM32MP15x, DDR3L, STPMIC1A, 4KB EEPROM, Oscillator and passive components integrated into a single package
  • STM32MP15x Features: o Arm® Cortex®-A7 up to 800MHz x2 o Arm® Cortex®-M4 up to 209MHz o NEON™SIMD Coprocessor x2 o Arm® TrustZone® o USB 2.0 HS + PHY x2 o Ethernet 10/100/1000 o CAN FD/TTCAN x2, UART x4, USART x4, SPI x6, I2C x6, I2S x3, QSPI x2 o eMMC/SD/SDIO Ports x3 o GPIO x148 o 24-bit RGB Display, MIPI DSI o Camera Interface o 22 Channel 16-bit ADC x2, 12-bit DAC x2 o Configurable I/O voltage (1.8V - 3.3V) OSD32MP15x Block Diagram
  • Access to all Signals of the STM32MP1 TFBGA 361 Package
  • Up to 1GB DDR3L
  • Low Power MEMS Oscillator
  • Single Voltage Input: 2.8V-5.5V
  • Integrated Boost: 5.2V
  • System Power: Buck, Boost, LDOx4, Power Switch x2 Benefits
  • Integrates over 100 components
  • Compatible with STM32MP1 development tools and software