OSD32MP157F Description
OSD32MP15x Datasheet Rev. 7 11/30/2022 Introduction The OSD32MP15x System-in-Package (SiP) devices deliver all the power of a Microprocessor in a package that feels like a Microcontroller in the smallest possible footprint. At their core, the OSD32MP15x devices have the versatile STMicroelectronics STM32MP15x featuring Dual Arm® Cortex® A7 Cores and an Arm® Cortex® M4.
OSD32MP157F Key Features
- ST STM32MP15x, DDR3L, STPMIC1A, 4KB EEPROM, Oscillator and passive ponents integrated into a single package
- Access to all Signals of the STM32MP1 TFBGA 361 Package
- Up to 1GB DDR3L
- Low Power MEMS Oscillator
- Single Voltage Input: 2.8V-5.5V
- Integrated Boost: 5.2V
- System Power: Buck, Boost, LDOx4
- Integrates over 100 ponents
- patible with STM32MP1
- Significantly reduces design time