ESD1014 Datasheet | onsemi

Features - Low Capacitance (6 p F Maximum Between I/O Lines and GND) - ESD Rating of Class 3B (Exceeding 8 k V) per Human Body model and Class C (Exceeding 400 V) per Machine Model - Protection for the Following IEC Standards: IEC 61000- 4- 2 (ESD) Level 4 - 30 k V (Contact) - SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC- Q101 Qualified and PPAP Capable - This is a Pb- Free Device Typical Applications - High Speed munication Line Protection - USB 1.1 and 2.0 Power and Data Line Protection - Digital Video Interface (DVI) - Monitors and Flat Panel Displays - T1/E1 and T3/E3 - 10/100/1000 Ethernet Protection - Gigabit Ethernet Protection MAXIMUM RATINGS (TJ = 25C unless otherwise noted) Rating Symbol Value Unit Peak Power Dissipation (Note 1) Maximum Peak Pulse Current (Note 1) Ppk Operating Junction Temperature Range - 40 to +125 C Storage Temperature Range Tstg - 55 to +150 C Lead Solder Temperature - Maximum (10 Seconds) C Machine Model (MM) Human Body Model (HBM) IEC 61000- 4- 2 Contact (ESD) 0.4 k V Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. 8/20 ms Waveform per Figure 2 (@ TA = 25C). LOW CAPACITANCE DIODE SURGE PROTECTION ARRAY PIN CONFIGURATION AND...