ISL9V3040x3ST-F085C
EcoSPARK) Ignition IGBT
300 mJ, 400 V, N−Channel Ignition IGBT
Features
• SCIS Energy = 300 mJ at TJ = 25°C
• Logic Level Gate Drive
• AEC−Q101 Qualified and PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant
Applications
• Automotive Ignition Coil Driver Circuits
• High Current Ignition System
• Coil on Plug Application
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Symbol
Parameter
Value
Unit
BVCER Collector to Emitter Breakdown
Voltage (IC = 1 mA)
400 V
BVECS Emitter to Collector Voltage − Reverse
Battery Condition (IC = 10 mA)
24
V
ESCIS25
ESCIS150
IC25
IC110
VGEM
ISCIS = 14.2 A, L = 3.0 mHy,
RGE = 1 KW, TC = 25°C (Note 1)
ISCIS = 10.6 A, L = 3.0 mHy,
RGE = 1 KW, TC = 150°C (Note 2)
Collector Current Continuous
at VGE = 4.0 V, TC = 25°C
Collector Current Continuous
at VGE = 4.0 V, TC = 110°C
Gate to Emitter Voltage Continuous
300 mJ
170 mJ
21 A
17 A
±10 V
PD
TJ, TSTG
Power Dissipation Total, TC = 25°C
Power Dissipation Derating, TC > 25°C
Operating Junction and Storage
Temperature
150
1
−55 to +175
W
W/°C
°C
TL Lead Temperature for Soldering
Purposes (1/8” from case for 10 s)
300 °C
TPKG Reflow Soldering according to
JESD020C
260 °C
ESD
HBM−Electrostatic Discharge Voltage
at 100 pF, 1500 W
4
kV
CDM−Electrostatic Discharge Voltage
at 1 W
2
kV
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Self clamped inductive Switching Energy (ESCIS25) of 300 mJ is based on
the test conditions that is starting TJ = 25°C, L = 3 mHy, ISCIS = 14.2 A,
VCC = 100 V during inductor charging and VCC = 0 V during time in clamp.
2. Self Clamped inductive Switching Energy (ESCIS150) of 170 mJ is based on
the test conditions that is starting TJ = 150°C, L = 3mHy, ISCIS = 10.6 A,
VCC = 100 V during inductor charging and VCC = 0 V during time in clamp.
www.onsemi.com
COLLECTOR
GATE
R1
R2
EMITTER
DPAK3
CASE 369AS
D2PAK−3
CASE 418AJ
MARKING DIAGRAM
AYWW
XXX
XXXXXG
A
Y
WW
XXXX
G
= Assembly Location
= Year
= Work Week
= Device Code
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information on page 2
of this data sheet.
© Semiconductor Components Industries, LLC, 2016
August, 2019 − Rev. 1
1
Publication Order Number:
ISL9V3040−F085C//D