MM74HC574 Description
20−Lead Small Outline Integrated Circuit (SOIC), JEDEC MS−013, 0.300″ Wide 20−Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3 mm Wide 20−Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO−153, 4.4 mm Wide 20−Lead Plastic Dual−In−Line Package (PDIP),.
MM74HC574 Key Features
- Typical Propagation Delay: 18 ns
- Wide Operating Voltage Range: 2 V
- Low Input Current: 1 mA Maximum
- Low Quiescent Current: 80 mA Maximum
- patible with Bus-oriented Systems
- Output Drive Capability: 15 LS-TTL Loads
- 0.5 to +
- plastic “N” package
- 12 mW/°C from 65°C to 85°C
- Rev. 2