MSRF1560G Datasheet | onsemi

Features - Soft Recovery with Low Reverse Recovery Charge (QRR) and Peak Reverse Recovery Current (IRRM) - Epoxy meets UL 94 V- 0 @ 0.125 in - Low Forward Voltage - Low Leakage Current - High Temperature Glass Passivated Junction - These are Pb- Free Devices Mechanical Characteristics: - Case: Epoxy, Molded - Weight: 1.9 Grams (Approximately) - Finish: All External Surfaces Corrosion Resistant and Terminal Leads Readily Solderable - Lead Temperature for Soldering Purposes: 260°C Max. for 10 Seconds MAXIMUM RATINGS Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (At Rated VR, TC = 125°C) Peak Repetitive Forward Current (At Rated VR, Square Wave, 20 k Hz,TC = 125°C) Non- Repetitive Peak Surge Current (Surge applied at rated load conditions, halfwave, single phase, 60 Hz) Symbol VRRM VRWM VR IO IFRM IFSM Value 600 15 30 100 Unit V Operating Junction and Storage Temperature Range TJ, Tstg - 65 to +150 °C THERMAL CHARACTERISTICS Parameter Symbol Value Unit MSR1560G: Thermal Resistance Junction- to- Case Junction- to- Ambient RRqq JJCA °C/W 1.6 72.8 MSRF1560G: Thermal Resistance Junction- to- Case Junction- to- Ambient Rq JC Rq JA °C/W 4.25 75 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected....