MURA205NHP220SF
Overview
- Fast Soft Switching for Reduced EMI and Higher Efficiency
- Low Profile - Maximum Height of 1.0 mm
- Small Footprint - Footprint Area of 5.94 mm2
- NRV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable
- These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant Mechanical Characteristics:
- Case: Molded Epoxy
- Epoxy Meets UL 94 V-0 @ 0.125 in
- Weight: 11.7 mg (Approximately)
- Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Maximum for 10 Seconds
- MSL 1
