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NTD360N65S3H Datasheet

N-Channel MOSFET

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MOSFET - Power,
N‐Channel, SUPERFET) III,
FAST
650 V, 360 mW, 10 A
NTD360N65S3H
Description
SUPERFET III MOSFET is ON Semiconductor’s brand-new high
voltage super-junction (SJ) MOSFET family that is utilizing charge
balance technology for outstanding low on-resistance and lower gate
charge performance. This advanced technology is tailored to minimize
conduction loss, provides superior switching performance, and
withstand extreme dv/dt rate.
Consequently, SUPERFET III FAST MOSFET series helps
minimize various power systems and improve system efficiency.
Features
700 V @ TJ = 150°C
Typ. RDS(on) = 296 mW
Ultra Low Gate Charge (Typ. Qg = 17.5 nC)
Low Effective Output Capacitance (Typ. Coss(eff.) = 180 pF)
100% Avalanche Tested
These Devices are PbFree and are RoHS Compliant
Applications
Computing / Display Power Supplies
Telecom / Server Power Supplies
Industrial Power Supplies
Lighting / Charger / Adapter
www.onsemi.com
VDSS
650 V
RDS(ON) MAX
360 mW @ 10 V
ID MAX
10 A
D
G
S
DPAK
CASE 369AS
MARKING DIAGRAM
T360N
65S3H
AYWWZZ
T360N65S3H
A
Y
WW
ZZ
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Lot Code
ORDERING INFORMATION
See detailed ordering and shipping information on page 2 of
this data sheet.
© Semiconductor Components Industries, LLC, 2020
1
March, 2021 Rev. 2
Publication Order Number:
NTD360N65S3H/D


  ON Semiconductor Electronic Components Datasheet  

NTD360N65S3H Datasheet

N-Channel MOSFET

No Preview Available !

NTD360N65S3H
ABSOLUTE MAXIMUM RATINGS (TC = 25°C, Unless otherwise specified)
Symbol
Parameter
Value
Unit
VDSS
VGSS
Drain to Source Voltage
Gate to Source Voltage
DC
AC (f > 1 Hz)
650
V
±30
V
±30
V
ID
Drain Current
Continuous (TC = 25°C)
10
Continuous (TC = 100°C)
6
IDM
Drain Current
Pulsed (Note 1)
28
EAS
Single Pulsed Avalanche Energy (Note 2)
75
IAS
Avalanche Current (Note 2)
1.9
EAR
Repetitive Avalanche Energy (Note 1)
0.83
dv/dt
MOSFET dv/dt
120
A
A
mJ
A
mJ
V/ns
Peak Diode Recovery dv/dt (Note 3)
20
PD
Power Dissipation
(TC = 25°C)
Derate Above 25°C
83
W
0.66
W/°C
TJ, TSTG Operating and Storage Temperature Range
55 to +150
°C
TL
Maximum Lead Temperature for Soldering, 1/8from Case for 5 s
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Repetitive rating: pulse-width limited by maximum junction temperature.
2. IAS = 1.9 A, RG = 25 W, starting TJ = 25°C.
3. ISD 5.0 A, di/dt 200 A/ms, VDD 400 V, starting TJ = 25°C.
THERMAL CHARACTERISTICS
Symbol
Parameter
RqJC
Thermal Resistance, Junction to Case, Max.
RqJA
Thermal Resistance, Junction to Ambient, Max. (Note 4)
4. Device on 1 in2 pad 2 oz copper pad on 1.5 × 1.5 in. board of FR4 material.
Value
1.51
40
Unit
_C/W
PACKAGE MARKING AND ORDERING INFORMATION
Part Number
Top Marking
Package
Reel Size Tape Width
Shipping
NTD360N65S3H
T360N65S3H
DPAK
330 mm
16 mm
2500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
www.onsemi.com
2


Part Number NTD360N65S3H
Description N-Channel MOSFET
Maker ON Semiconductor
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