F1047B Description
Infrarot emittierender Chip, Oberseite Kathodenanschluss Infrared emitting die, top side cathode connection Infrarot emittierender Chip, Oberseite Kathodenanschluss, Oberfläche aufgerauht. Infrared emitting die, top side cathode connection, surface frosted 2003-04-11 1 .. Einheit Unit nm ∆λ 100 nm tr, tf 0.5/0.4 µs VR 5 V VF 1.9 V Φe 12 14 Ie mW mW 0.50 0.65 a.u.
F1047B Key Features
- Typ. total radiant power: 22 mW @ 100 mA in TOPLED® package
- Chipsize: 300 x 300 µm²
- Very highly efficient GaAlAs LED
- High reliability
- High pulse handling capability
- Good spectral match to silicon photodetectors
- Frontside metallization: aluminum Backside metallization: gold alloy
- Delivery: diced on foil
F1047B Applications
- IR remote control for hifi and TV sets, video tape recorder, dimmers
- Remote control for steady and varying intensity