BZX55C33 Key Features
- Planar Die construction
- 500mW Power Dissipation
- Ideally Suited for Automated Assembly Processes
- Acqire quality system certificate : TS16949
- Manufactured in accordance with AECQ101
- Lead free in ply with EU RoHS 2002/95/EC directives
- Case: Molded glass DO-35
- Terminals: Solderable per MIL-STD-750, Method 2026
- Polarity: See Diagram Below
- Approx. Weight: 0.13 grams
