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2SD1845
Unit: mm
s
q q
21.0± 0.5 15.0± 0.2 0.7
15.0± 0.3 11.0± 0.2
5.0± 0.2 3.2
q q q q
φ3.2± 0.1
16.2± 0.5 3.2 2.3
2.0± 0.2
2.0± 0.1 0.6± 0.2
Solder Dip
1.1± 0.1
s
(TC=25˚C)
TC=25°C Ta=25°C
s
(TC=25˚C)
、 ht tp :// w w w 、 .s em ic on .p an as 、 on ic 。 .c o. jp 。
5.45± 0.3 10.9± 0.5 2
VCBO VCES VCEO VEBO ICP IC IB
1500 1500 700 7 7 V V V V A A A 2.5 1.5 60 3 150 –55 ~ +150 ICBO VEBO hFE VCE(sat) VBE(sat) fT tstg tf tstg tf VF Lleak = 5µH VCC = 200V
1
3
1:Base 2:Collector 3:Emitter TOP–3 Full Pack Package(b)
PC Tj
C
B
W
E
˚C ˚C
Tstg
VCB = 750V, IE = 0
10 1
µA mA V
VCB = 1500V, IE = 0
IE = 500mA, IC = 0
7 5
VCE = 5V, IC = 0.5A VCE = 10V, IC = 2A IC = 2A, IB = 0.6A IC = 2A, IB = 0.6A
25
3.5 8 1.