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BM61S41RFV-C Datasheet

1ch Gate Driver Providing Galvanic Isolation

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Datasheet
Gate Driver Providing Galvanic Isolation Series
Isolation Voltage 3750 Vrms
1ch Gate Driver Providing Galvanic Isolation
BM61S41RFV-C
General Description
The BM61S41RFV-C is a gate driver with an isolation
voltage of 3750 Vrms, I/O delay time of 65 ns, and
minimum input pulse width of 60 ns. It has the
Under-Voltage Lockout (UVLO) function and Miller clamp
function.
Key Specifications
Isolation Voltage:
Maximum Gate Drive Voltage:
I/O Delay Time:
Minimum Input Pulse Width:
Output Current
3750 Vrms
24 V
65 ns(Max)
60 ns
4A
Features
AEC-Q100 Qualified(Note 1 )
Providing Galvanic Isolation
Active Miller Clamping
Under-Voltage Lockout Function
UL1577(pending)
(Note 1) Grade1
Package
SSOP-B10W
W(Typ) x D(Typ) x H(Max)
3.5 mm x10.2 mm x 1.9 mm
Applications
SiC MOSFET Gate Drive
SSOP-B10W
Typical Application Circuits
CVCC1
GND1
VCC1
INA
INB
GND1
Isolation
UVLO1
Pulse
Generator
UVLO2
Logic
-
+ 2V
Figure 1. For Driving SiC without Negative Power Supply
GND2
VCC2
OUT
MC
GND2
Pin 1
CVCC2
Product structure : Silicon integrated circuit
.www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 14 • 001
This product has no designed protection against radioactive rays
1/23
TSZ02201-0818ACH00130-1-2
15.Jun.2018 Rev.001


Rohm Semiconductor Electronic Components Datasheet

BM61S41RFV-C Datasheet

1ch Gate Driver Providing Galvanic Isolation

No Preview Available !

BM61S41RFV-C
Contents
General Description ..............................................................................................................................................................1
Features ................................................................................................................................................................................1
Applications ..........................................................................................................................................................................1
Key Specifications ................................................................................................................................................................1
Package
W(Typ) x D(Typ) x H(Max)..................................................................................................................1
Typical Application Circuits ..................................................................................................................................................1
Contents ................................................................................................................................................................................ 2
Recommended Range of External Constants.......................................................................................................................3
Pin Configurations ................................................................................................................................................................3
Pin Descriptions....................................................................................................................................................................3
Description of Functions and Examples of Constant Setting ..............................................................................................5
Absolute Maximum Ratings..................................................................................................................................................8
Thermal Resistance (Note 5).....................................................................................................................................................8
Recommended Operating Conditions ..................................................................................................................................9
Insulation Related Characteristics........................................................................................................................................9
Electrical Characteristics.................................................................................................................................................... 10
Typical Performance Curves............................................................................................................................................... 11
Figure 7. Input-side Circuit Current 1 vs Input-side Supply Voltage ...................................................................................... 11
Figure 8. Input-side Circuit Current 1 vs Temperature ......................................................................................................... 11
Figure 9. Input-side Circuit Current 2 vs Input-side Supply Voltage (At INA=100 kHz, Duty=50 %)........................................ 11
Figure 10. Input-side Circuit Current 2 vs Temperature (At INA=100 kHz, Duty=50 %) ......................................................... 11
Figure 11. Output-side Circuit Current 1 vs Output-side Supply Voltage (At OUT=L)............................................................. 12
Figure 12. Output-side Circuit Current 1 vs Temperature (At OUT=L)................................................................................... 12
Figure 13. Output-side Circuit Current 2 vs Output-side Supply Voltage (At OUT=H)............................................................ 12
Figure 14. Output-side Circuit Current 2 vs Temperature (At OUT=H) .................................................................................. 12
Figure 15. Logic High/Low Level Input Voltage.................................................................................................................... 13
Figure 16 Output Voltage vs Logic Level Input Voltage (INA) ............................................................................................... 13
Figure 17. Logic Pull-up/down Resistance vs Temperature.................................................................................................. 13
Figure 18. Logic Input Minimum Pulse Width vs Temperature.............................................................................................. 13
Figure 19. OUT ON Resistance (Source) vs Temperature ................................................................................................... 14
Figure 20. OUT ON Resistance (Sink) vs Temperature........................................................................................................ 14
Figure 21. Turn ON Time vs Temperature ........................................................................................................................... 14
Figure 22. Turn OFF Time vs Temperature ......................................................................................................................... 14
Figure 23. Turn ON Time vs Temperature (INA=H, INB=PWM)............................................................................................ 15
Figure 24. Turn OFF Time vs Temperature (INA=H, INB=PWM) .......................................................................................... 15
Figure 25. MC ON Resistance vs Temperature ................................................................................................................... 15
Figure 26. MC ON Threshold Voltage vs Temperature......................................................................................................... 15
Figure 27. VCC1 UVLO ON/OFF Voltage vs Temperature ..................................................................................................... 16
Figure 28. VCC1 UVLO Mask Time vs Temperature.............................................................................................................. 16
Figure 29. VCC2 UVLO ON/OFF Voltage vs Temperature ..................................................................................................... 16
Figure 30. VCC2 UVLO Mask Time vs Temperature.............................................................................................................. 16
Application Examples ......................................................................................................................................................... 17
I/O Equivalence Circuits...................................................................................................................................................... 18
Operational Notes ............................................................................................................................................................... 19
1. Reverse Connection of Power Supply .................................................................................................................. 19
2. Power Supply Lines .............................................................................................................................................. 19
3. Ground Voltage...................................................................................................................................................... 19
4. Ground Wiring Pattern .......................................................................................................................................... 19
5. Recommended Operating Conditions................................................................................................................... 19
6. Inrush Current ....................................................................................................................................................... 19
7. Testing on Application Boards.............................................................................................................................. 19
8. Inter-pin Short and Mounting Errors..................................................................................................................... 19
9. Unused Input Pins................................................................................................................................................. 20
10. Regarding the Input Pin of the IC.......................................................................................................................... 20
11. Ceramic Capacitor................................................................................................................................................. 20
Ordering Information .......................................................................................................................................................... 21
Marking Diagram................................................................................................................................................................. 21
Physical Dimension and Packing Information.................................................................................................................... 22
Revision History.................................................................................................................................................................. 23
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 15 001
2/23
TSZ02201-0818ACH00130-1-2
15.Jun.2018 Rev.001


Part Number BM61S41RFV-C
Description 1ch Gate Driver Providing Galvanic Isolation
Maker ROHM
Total Page 27 Pages
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