R8003KND3
lThermal characteristics
Parameter
Thermal resistance, junction - case
Thermal resistance, junction - ambient
Soldering temperature, wavesoldering for 10s
Datasheet
Symbol
Rth(j-c)*4
Rth(j-a)
Tsold
Values
Unit
Min. Typ. Max.
- - 2.6 ℃/W
- - 147 ℃/W
- - 265 ℃
lStatic characteristics (Ta = 25°C)
Parameter
Symbol
Conditions
Drain - Source breakdown
voltage
Zero gate voltage
drain current
Gate - Source leakage current
Gate threshold voltage
Static drain - source
on - state resistance
V(BR)DSS VGS = 0V, ID = 1mA
IDSS VDS = 800V, VGS = 0V
IGSS
VGS(th)
VGS = ±20V, VDS = 0V
VDS = VGS, ID = 2mA
RDS(on)*5 VGS = 10V, ID = 1.5A
Values
Unit
Min. Typ. Max.
800 - - V
- - 100 μA
- - ±100 nA
2.5 3.5 4.5 V
- 1.5 1.8 Ω
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20190619 - Rev.002
