1N4454 Overview
Tj -65 to 175 °C Tstg -65 to 175 °C Items Materials Package DO-35 Case Hermetically sealed glass Lead/Finish Double stud/Solder Plating Chip Glass Passivated Dimensions (DO-35) DO-35 26 MIN 0.457 0.559 DIA. Dimensions in millimeters (Ta=25°C) Ratings Minimum Breakdown Voltage IR= 5.0uA IR= 100uA Peak Forward Surge Current PW= 1sec.


