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ZSSC3026 Datasheet

16-Bit Sensor Signal Conditioner

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Low Power, High Resolution 16-Bit
Sensor Signal Conditioner
ZSSC3026
Datasheet
Brief Description
The ZSSC3026 is a sensor signal conditioner (SSC)
integrated circuit for high-accuracy amplification and
analog-to-digital conversion of a differential input
signal. Developed for correction of resistive bridge
sensors and optimized for high-resolution altimeter
module applications, the ZSSC3026 can perform
offset, span, and 1st and 2nd order temperature com-
pensation of the measured signal. It can also provide
a corrected temperature output measured with an
internal sensor. The corrected measurement values
are provided at the digital output pins, which can be
configured as I2C™* (3.4MHz) or SPI (20MHz).
Digital compensation of the signal offset, sensitivity,
temperature, and non-linearity is accomplished via
an 18-bit internal digital signal processor (DSP) run-
ning a correction algorithm. Calibration coefficients
are stored on-chip in a highly reliable, non-volatile,
multiple-time programmable (MTP) memory. Prog-
ramming the ZSSC3026 is simple via the serial
interface. An internal charge pump provides the
programming voltage. The interface is used for the
PC-controlled calibration procedure, which programs
the calibration coefficients in memory. The digital
mating is fast and precise, eliminating the overhead
normally associated with trimming external com-
ponents and multi-pass calibration routines.
Features
Flexible, programmable analog front-end design;
up to 16-bit scalable, charge-balancing two-
segment analog-to-digital converter (ADC)
Fully programmable gain amplifier for optimizing
sensor signals: gain range 14 to 72 (linear)
Internal auto-compensated temperature sensor
Digital compensation of individual sensor offset;
1st and 2nd order compensation of sensor gain
Digital compensation of 1st and 2nd order tem-
perature gain and offset drift
Intelligent power management unit
Layout customized for die-die bonding with
sensor for high-density chip-on-board assembly
Typical sensor elements can achieve accuracy of
better than ±0.10% FSO @ -40 to 85°C
* I2C™ is a registered trademark of NXP.
Benefits
Excellent for low-voltage and low-power battery
applications
Integrated 18-bit calibration math DSP
Costs minimized via one-pass calibration
No external trimming components required
Highly integrated CMOS design
Physical Characteristics
Supply voltage range: 1.8 to 3.6V
Current consumption: 900µA (operating mode)
Sleep State current: 50nA (typical)
Temperature resolution: <0.003K/LSB
Operation temperatures depending on part
number: –40°C to +85°C
Small die size
Delivery options: die for wafer bonding, bumped
die for Flip Chip, PQFN24
Typical Applications
The ZSSC3026 is designed for operation in cali-
brated resistive (e.g., pressure) sensor modules:
Barometric altitude measurement for portable
navigation
Altitude measurement for emergency call
systems and car navigation
Inside hard disk pressure measurement
Weather forecast
Fan control
ZSSC3026 Application Example
© 2016 Integrated Device Technology, Inc.
1
March 28, 2016


Renesas Electronics Components Datasheet

ZSSC3026 Datasheet

16-Bit Sensor Signal Conditioner

No Preview Available !

Low Power, High Resolution 16-Bit
Sensor Signal Conditioner
ZSSC3026
Datasheet
ZSSC3026 Block Diagram
VDDB
VTP Temperature
Reference
VTN Sensor
AGND / CM
Generator
Vreg int
Bias Current
Generator
Voltage
Regulator
Power Ctr.
ZSSC3026
VDD
VSS
Sensor
Bridge
INP
INN
VSSB
Power-On
Reset
Pre-
Amplifier
Clock
Generator Ring
Oscillator
A
D
16 Bit
System
Control
Unit
DSP Core
(Calculations,
Communication)
EOC
MTP
ROM
SPI
I²C
SCLK/SCL
SS
MOSI/SDA
MISO
SEL
Ordering Information (Please contact IDT Sales for additional options)
Sales Code
ZSSC3026CC1B
ZSSC3026CI1B
ZSSC3026KIT
Description
ZSSC3026 Die — temperature range: –40°C to +85 °C, tested
ZSSC3026 Die — temperature range: –40°C to +85 °C; extended qualification:
tested, 10 years MTP-data retention, HTOL tested
Evaluation Kit for ZSSC30x6 Product Family; two circuit boards, cable, and
1 sample (Evaluation Software is downloadable from www.IDT.com/ZSSC3026)
Package
Unsawn wafer (304µm)
Unsawn wafer (304µm)
Kit
© 2016 Integrated Device Technology, Inc.
2
March 28, 2016



Part Number ZSSC3026
Description 16-Bit Sensor Signal Conditioner
Maker Renesas
Total Page 3 Pages
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ZSSC3026 Datasheet PDF





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