RB751S-40
Features
1) Ultra small mold type. (EMD2) 2) Low VF 3) High reliability
- Construction Silicon epitaxial planar
0.3±0.05
ROHM : EMD2 JEDEC :SOD-523 JEITA : SC-79 dot (year week factory)
- Taping specifications(Unit : mm)
4.0±0.1
2.0±0.05
0.6±0.1
φ1.5±0.05 φ1.55±0.05
EMD2
- Structure
0.2±0.05
1.75±0.1
0.6 3.5±0.05 8.0±0.15
11..2256±0.0.0065
- 00
2.2.4405±±0.0.015 11..235±0.0066
- 0
00.9.905±±0.005.06 0
E空mポptケy pッoトcket 4.0±0.1
2.0±0.05
φ0.5
- Absolute maximum ratings(Ta=25°C)
Parameter
Symbol
Reverse voltage (repetitive peak) Reverse voltage (DC) Average retified forward current
VRM VR Io
Forward currnt surge peak(60Hz/1cyc) Junction temperature
IFSM Tj
Storage temperature
Tstg
Limits 40 30 30 200 125
-40 to +125
Unit V V m A m A °C °C
0.2 00.7.756±±0.005.05
- Electrical characteristics(Ta=25°C)
Parameter
Symbol Min. Typ. Max.
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