PC123X5YUP0F
Description
PC123XNNSZ0F Series contains an IRED optically coupled to a phototransistor. It is packaged in a 4-pin DIP, available in wide-lead spacing option and SMT gullwing lead-form option.
Key Features
- 4-pin DIP package
- Double transfer mold package (Ideal for Flow Solder- ing)
- Current transfer ratio (CTR : MIN. 50% at IF=5 mA, VCE=5V)
- Several CTR ranks available
- Reinforced insulation type (Isolation distance : MIN.
- Long creepage distance type (wide lead-form type only : MIN. 8mm)
- High isolation voltage between input and output (Viso(rms) : 5kV)
- RoHS directive compliant
