Datasheet4U Logo Datasheet4U.com

PC123X5NSZ0F - Photocoupler

Download the PC123X5NSZ0F datasheet PDF. This datasheet also covers the PC123XNNSZ0F variant, as both devices belong to the same photocoupler family and are provided as variant models within a single manufacturer datasheet.

General Description

PC123XNNSZ0F Series contains an IRED optically coupled to a phototransistor.

It is packaged in a 4-pin DIP, available in wide-lead spacing option and SMT gullwing lead-form option.

Input-output isolation voltage(rms) is 5kV.

Key Features

  • s 1. 4-pin DIP package 2. Double transfer mold package (Ideal for Flow Solder- ing) 3. Current transfer ratio (CTR : MIN. 50% at IF=5 mA, VCE=5V) 4. Several CTR ranks available 5. Reinforced insulation type (Isolation distance : MIN. 0.4mm) 6. Long creepage distance type (wide lead-form type only : MIN. 8mm) 7. High isolation voltage between input and output (Viso(rms) : 5kV) 8. RoHS directive compliant.
  • Agency approvals/Compliance 1. Recognized by UL1577 (Double protection isolation), file.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (PC123XNNSZ0F-SHARP.pdf) that lists specifications for multiple related part numbers.

More Datasheets from Sharp Corporation

Part Number Description
PC123X5NFZ0F Photocoupler
PC123X5NUP0F Photocoupler
PC123X5YFZ0F Photocoupler
PC123X5YIP0F Photocoupler
PC123X5YSZ0F Photocoupler
PC123X5YUP0F Photocoupler
PC123X1NFZ0F Photocoupler
PC123X1NSZ0F Photocoupler
PC123X1NUP0F Photocoupler
PC123X1YFZ0F Photocoupler

Full PDF Text Transcription for PC123X5NSZ0F (Reference)

Note: Below is a high-fidelity text extraction (approx. 800 characters) for PC123X5NSZ0F. For precise diagrams, tables, and layout, please refer to the original PDF.

View original datasheet text
PC123XNNSZ0F Series PC123XNNSZ0F DIP 4pin Reinforced Insulation Type Photocoupler Series ■ Description PC123XNNSZ0F Series contains an IRED optically coupled to a phototransistor. It is packaged in a 4-pin DIP, available in wide-lead spacing option and SMT gullwing lead-form option. Input-output isolation voltage(rms) is 5kV. CTR is 50% to 400% at input current of 5mA ■ Features 1. 4-pin DIP package 2. Double transfer mold package (Ideal for Flow Solder- ing) 3. Current transfer ratio (CTR : MIN. 50% at IF=5 mA, VCE=5V) 4. Several CTR ranks available 5. Reinforced insulation type (Isolation distance : MIN. 0.4mm) 6. Long creepage distance type (wide lead-form type only : MIN. 8mm) 7. High isolation voltage between input and output (Viso(rms) : 5kV) 8.