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S71GL256NB0 Datasheet (S71GLxxxNB0) Stacked Multi-chip Product (MCP)

Manufacturer: Spansion (now Infineon)

Download the S71GL256NB0 datasheet PDF. This datasheet also includes the S71GL128NB0 variant, as both parts are published together in a single manufacturer document.

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Note: The manufacturer provides a single datasheet file (S71GL128NB0_SPANSION.pdf) that lists specifications for multiple related part numbers.

General Description

The S71GL Series is a product line of stacked Multi-chip Product (MCP) packages and consists of „ One Flash memory die „ one pSRAM The products covered by this document are listed in the table below.

For details about their specifications, please refer to the individual constituent datasheets for further details.

Flash Memory Density 512 Mb 128 Mb pSRAM Density 64 Mb 32 Mb 16 Mb S71GL512NB0 S71GL256NB0 S71GL128NB0 256 Mb 128 Mb Publication Number S71GL512_256_128NB0_00 Revision A Amendment 1 Issue Date December 7, 2004 This document contains information on a product under development at Spansion LLC.

Overview

www.DataSheet4U.com S71GL512NB0/S71GL256NB0/ S71GL128NB0 Stacked Multi-chip Product (MCP) 512/256/128 Megabit (32/16/8 M x 16-bit) CMOS 3.

Key Features

  • Power supply voltage of 2.7 to 3.1V High Performance.
  • 90 ns access time (S71GL128N, S71GL256N) 100 ns access time (S71GL512N) 25 ns page read times Packages:.
  • 9.0 x 12.0 mm x 1.2 mm FBGA (TLD084) (S71GL512N).
  • 8.0 x 11.6 mm x 1.2 mm FBGA (TLA084) (S71GL128N, S71GL256N).
  • Operating Temperature.
  • -25°C to +85°C (Wireless).
  • -40°C to +85°C (Industrial) General.