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FBGA-SD Datasheet - STATS ChipPAC

Fine Pitch Ball Grid Array

FBGA-SD Features

* 2 die to 7 die stack with spacer capability

* 5 x 5mm to 23 x 23mm body size

* Package height at 1.0, 1.2, 1.4 and 1.7mm max.

* Flexible die stacking options (“pyramid,” “same die,” etc.)

* 0.5mm to 1.0mm ball pitch, Eutectic and Lead-free solder ball

FBGA-SD General Description

STATS ChipPAC’s Fine Pitch Ball Grid Array Stacked Die (FBGA-SD) offering includes LFBGA-SD, TFBGA-SD, VFBGA-SD and WFBGA-SD packages. Tape versions of VFBGA-SD and TFBGA-SD are also available. STATS ChipPAC’s chip stack technology offers the flexibility of stacking 2 to 7 die in a single package. D.

FBGA-SD Datasheet (589.36 KB)

Preview of FBGA-SD PDF

Datasheet Details

Part number:

FBGA-SD

Manufacturer:

STATS ChipPAC

File Size:

589.36 KB

Description:

Fine pitch ball grid array.
www.DataSheet4U.com FBGA-SD Fine Pitch Ball Grid Array - Stacked Die FBGA-SD: Laminate substrate based enabling 2 & 4 layers of routing fle.

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TAGS

FBGA-SD Fine Pitch Ball Grid Array STATS ChipPAC

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FBGA-SD Datasheet Preview Page 2

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