FBGA-SD Key Features
- 2 die to 7 die stack with spacer capability
- 5 x 5mm to 23 x 23mm body size
- Package height at 1.0, 1.2, 1.4 and 1.7mm max
- Flexible die stacking options (“pyramid,” “same die,” etc.)
- 0.5mm to 1.0mm ball pitch, Eutectic and Lead-free solder ball
- Flash/SRAM/PSRAM/Logic/Analog binations
- JEDEC standard package outlines
- Die thinning to 75um (3mils) capability
- Low loop wire bonding; reverse and die to die
- Up to 2mm die overhang per side