• Part: FBGA
  • Manufacturer: STATS ChipPAC
  • Size: 589.04 KB
Download FBGA Datasheet PDF
FBGA datasheet preview
FBGA page 2
Page 2

FBGA Key Features

  • Thin, lightweight, space saving package
  • Flexible body sizes range from 4mm x 4mm to 23mm x 23mm
  • 0.50, 0.65, 0.75, 0.80, 1.00mm ball pitch
  • Eutectic & Pb free solder balls
  • Green package available
  • Multiple routing layers and dedicated ground/power planes available for improved electrical performance
  • BT laminate materials (2 and 4 metal layers)
  • JEDEC standard pliant

Other FBGA Datasheets

Manufacturer Part Number Description
TopLine
TopLine		 FBGA96T.5-DC144 FBGA96T.5-DC144

FBGA Description

STATS ChipPAC’s Fine Pitch Ball Grid Array (FBGA) is a laminate substrate based chip scale package with plastic overmolded encapsulation and an array of fine pitch solder ball terminals. The FBGA package’s reduced outline and thickness and higher density options make it an ideal advanced technology packaging solution for high performance and/or portable applications. The use of the latest materials and advanced...