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FBGA - Fine Pitch Ball Grid Array

Description

STATS ChipPAC’s Fine Pitch Ball Grid Array (FBGA) is a laminate substrate based chip scale package with plastic overmolded encapsulation and an array of fine pitch solder ball terminals.

Features

  • Thin, lightweight, space saving package.
  • Flexible body sizes range from 4mm x 4mm to 23mm x 23mm.
  • 0.50, 0.65, 0.75, 0.80, 1.00mm ball pitch.
  • Eutectic & Pb free solder balls.
  • Green package available.
  • Multiple routing layers and dedicated ground/power planes available for improved electrical performance.
  • BT laminate materials (2 and 4 metal layers).
  • JEDEC standard compliant.

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Datasheet preview – FBGA

Datasheet Details

Part number FBGA
Manufacturer STATS ChipPAC
File Size 589.04 KB
Description Fine Pitch Ball Grid Array
Datasheet download datasheet FBGA Datasheet
Additional preview pages of the FBGA datasheet.

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Full PDF Text Transcription

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www.DataSheet4U.com FBGA Fine Pitch Ball Grid Array • Array molded, cost effective, space saving package solution • Available in 1.40mm (LFBGA), 1.20mm (TFBGA), and 1.00mm (VFBGA), 0.80mm (WFBGA) and 0.55mm (UFBGA) maximum thickness • Laminate substrate based package which enables 2 and 4 layers of routing flexibility FEATURES • Thin, lightweight, space saving package • Flexible body sizes range from 4mm x 4mm to 23mm x 23mm • 0.50, 0.65, 0.75, 0.80, 1.
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