STATS ChipPAC FBGA
The FBGA package’s reduced outline and thickness and higher density options make it an ideal advanced technology packaging solution for high performance and/or portable applications. The use of the latest materials and advanced assembly infrastructure produce a reliable and cost effective package. STATS ChipPAC’s FBGA is available in a broad range of JEDEC standard body sizes with LFBGA (| Part No. | FBGA |
|---|---|
| Datasheet | FBGA Download |
| Manufacturer | STATS ChipPAC |
| Description | Fine Pitch Ball Grid Array |
| Buy | Stock & Price |
FEATURES
● Thin, lightweight, space saving package● Flexible body sizes range from 4mm x 4mm to 23mm x 23mm
● 0.50, 0.65, 0.75, 0.80, 1.00mm ball pitch
● Eutectic & Pb free solder balls
● Green package available
● Multiple routing layers and dedicated ground/power planes available for improved electrical performance
● BT laminate materials (2 and 4 metal layers)
● JEDEC standard compliant
DESCRIPTION
STATS ChipPAC’s Fine Pitch Ball Grid Array (FBGA) is a laminate substrate based chip scale package with plastic overmolded encapsulation and an array of fine pitch solder ball terminals. Lead free and halogen free compatible material sets are available. <1.70mm [typically <1.40mm]), TFBGA (<1.20mm), VFBGA (<1.00mm), WFBGA (<0.80mm) and UFBGA (0.55mm max.) thickness. LFBGA-H (with attached heatsink) is qualified for small body sizes.APPLICATIONS
● Microprocessors/Controllers● Wireless RF
● Analog
● ASIC
● Memory
● Simple PLDs
● Others FBGA Fine Pitch Ball Grid Array SPECIFICATIONS Die Th...
