Datasheet Details
| Part number | FBGA |
|---|---|
| Manufacturer | STATS ChipPAC |
| File Size | 589.04 KB |
| Description | Fine Pitch Ball Grid Array |
| Datasheet |
 FBGA Datasheet
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General Description
STATS ChipPAC’s Fine Pitch Ball Grid Array (FBGA) is a laminate substrate based chip scale package with plastic overmolded encapsulation and an array of fine pitch solder ball terminals.
Key Features
- Thin, lightweight, space saving package.
- Flexible body sizes range from 4mm x 4mm to 23mm x 23mm.
- 0.50, 0.65, 0.75, 0.80, 1.00mm ball pitch.
- Eutectic & Pb free solder balls.
- Green package available.
- Multiple routing layers and dedicated ground/power planes available for improved electrical performance.
- BT laminate materials (2 and 4 metal layers).
- JEDEC standard compliant.