FBGA Datasheet Fine Pitch Ball Grid Array

Manufacturer: STATS ChipPAC

Overview: www.DataSheet4U.com FBGA Fine Pitch Ball Grid Array • Array molded, cost effective, space saving package solution • Available in 1.40mm (LFBGA), 1.20mm (TFBGA), and 1.00mm (VFBGA), 0.80mm (WFBGA) and 0.

Datasheet Details

Part number	FBGA
Manufacturer	STATS ChipPAC
File Size	589.04 KB
Description	Fine Pitch Ball Grid Array
Datasheet	FBGA_STATSChipPAC.pdf

General Description

STATS ChipPAC’s Fine Pitch Ball Grid Array (FBGA) is a laminate substrate based chip scale package with plastic overmolded encapsulation and an array of fine pitch solder ball terminals.

The FBGA package’s reduced outline and thickness and higher density options make it an ideal advanced technology packaging solution for high performance and/or portable applications.

The use of the latest materials and advanced assembly infrastructure produce a reliable and cost effective package.

Key Features

Thin, lightweight, space saving package.
Flexible body sizes range from 4mm x 4mm to 23mm x 23mm.
0.50, 0.65, 0.75, 0.80, 1.00mm ball pitch.
Eutectic & Pb free solder balls.
Green package available.
Multiple routing layers and dedicated ground/power planes available for improved electrical performance.
BT laminate materials (2 and 4 metal layers).
JEDEC standard compliant.

FBGA Distributor & Price

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FBGA-SD	Fine Pitch Ball Grid Array