Datasheet Details
| Part number | QFP-SD |
|---|---|
| Manufacturer | STATS ChipPAC |
| File Size | 647.87 KB |
| Description | Stacked Die Quad Flat Pack |
| Datasheet |
 QFP-SD Datasheet
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General Description
STATS ChipPAC’s Stacked Die QFP offering includes LQFPSD, LQFP-ep-SD and TQFP-ep-SD.
LQFP-SD is a stacked die low profile QFP.
LQFP-ep-SD is an exposed pad version that provides enhanced thermal performance.
Key Features
- Combining devices into one package reduces PCB real estate and cost.
- Increased sub-system performance by integrating multiple chips into a single package.
- Die to die bonding capability for device/signal integration.
- Standard and green/lead-free materials and Pb-free plating.
- Options for mixed technologies, 2 or more stacked dice.
- Fine pitch bonding capability.
- Exposed pad provides enhanced thermal performance.
- Low profile p.