QFP-EP Datasheet - STATS ChipPAC

QFP-EP Exposed Pad Quad Flat Pack

STATS ChipPAC’s Exposed Pad Quad Flat Pack (QFP-ep) is a thermally enhanced version of the QFP package. Thermal enhancement is achieved by means of an exposed die pad, which can be soldered to a mother PC board for effective heat removal and grounding. STATS ChipPAC’s QFP-ep family includes the Expo.

QFP-EP Features

* Body Sizes: 7 x 7mm to 24 x 24mm

* Package Height: 1.0mm (TQFP-ep) and 1.4mm (LQFP-ep)

* Lead Counts: 32L to 216L

* Lead Pitch: 0.40mm to 0.80mm

* Wide range of open tool leadframe and die pad sizes available

* JEDEC standard compliant

* Lead

QFP-EP Datasheet (238.22 KB)

QFP-EP Datasheet Preview — Preview of QFP-EP PDF

Datasheet Details

Part number:

QFP-EP

Manufacturer:

STATS ChipPAC

File Size:

238.22 KB

Description:

Exposed pad quad flat pack.

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TAGS

QFP-EP Exposed Pad Quad Flat Pack STATS ChipPAC

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