QFP-EP - Exposed Pad Quad Flat Pack
STATS ChipPAC’s Exposed Pad Quad Flat Pack (QFP-ep) is a thermally enhanced version of the QFP package.
Thermal enhancement is achieved by means of an exposed die pad, which can be soldered to a mother PC board for effective heat removal and grounding.
STATS ChipPAC’s QFP-ep family includes the Expo
QFP-EP Features
* Body Sizes: 7 x 7mm to 24 x 24mm
* Package Height: 1.0mm (TQFP-ep) and 1.4mm (LQFP-ep)
* Lead Counts: 32L to 216L
* Lead Pitch: 0.40mm to 0.80mm
* Wide range of open tool leadframe and die pad sizes available
* JEDEC standard compliant
* Lead
