Part number:
QFP-SD
Manufacturer:
STATS ChipPAC
File Size:
647.87 KB
Description:
Stacked die quad flat pack.
QFP-SD Features
* Combining devices into one package reduces PCB real estate and cost
* Increased sub-system performance by integrating multiple chips into a single package
* Die to die bonding capability for device/signal integration
* Standard and green/lead-free materials and Pb-f
Datasheet Details
QFP-SD
STATS ChipPAC
647.87 KB
Stacked die quad flat pack.
📁 Related Datasheet
QFP-SD Distributor