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QFP-SD Datasheet - STATS ChipPAC

QFP-SD - Stacked Die Quad Flat Pack

STATS ChipPAC’s Stacked Die QFP offering includes LQFPSD, LQFP-ep-SD and TQFP-ep-SD.

LQFP-SD is a stacked die low profile QFP.

LQFP-ep-SD is an exposed pad version that provides enhanced thermal performance.

TQFP-ep-SD is a thin profile exposed pad version with enhanced thermal performance.

STATS Ch

QFP-SD Features

* Combining devices into one package reduces PCB real estate and cost

* Increased sub-system performance by integrating multiple chips into a single package

* Die to die bonding capability for device/signal integration

* Standard and green/lead-free materials and Pb-f

QFP-SD_STATSChipPAC.pdf

Preview of QFP-SD PDF
QFP-SD Datasheet Preview Page 2

Datasheet Details

Part number:

QFP-SD

Manufacturer:

STATS ChipPAC

File Size:

647.87 KB

Description:

Stacked die quad flat pack.

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