QFP-SD - Stacked Die Quad Flat Pack
STATS ChipPAC’s Stacked Die QFP offering includes LQFPSD, LQFP-ep-SD and TQFP-ep-SD.
LQFP-SD is a stacked die low profile QFP.
LQFP-ep-SD is an exposed pad version that provides enhanced thermal performance.
TQFP-ep-SD is a thin profile exposed pad version with enhanced thermal performance.
STATS Ch
QFP-SD Features
* Combining devices into one package reduces PCB real estate and cost
* Increased sub-system performance by integrating multiple chips into a single package
* Die to die bonding capability for device/signal integration
* Standard and green/lead-free materials and Pb-f
