Description
STATS ChipPAC’s Stacked Die QFP offering includes LQFPSD, LQFP-ep-SD and TQFP-ep-SD.
Features
- Combining devices into one package reduces PCB real estate and cost.
- Increased sub-system performance by integrating multiple chips into a single package.
- Die to die bonding capability for device/signal integration.
- Standard and green/lead-free materials and Pb-free plating.
- Options for mixed technologies, 2 or more stacked dice.
- Fine pitch bonding capability.
- Exposed pad provides enhanced thermal performance.
- Low profile p.
QFP-SD_STATSChipPAC.pdf
