QFP-SD Datasheet - STATS ChipPAC

QFP-SD, Stacked Die Quad Flat Pack

www.DataSheet4U.com QFP-SD Stacked Die Quad Flat Pack * Stacking of die enables more functionality and integration in a conventional QFP pack.
STATS ChipPAC’s Stacked Die QFP offering includes LQFPSD, LQFP-ep-SD and TQFP-ep-SD.

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QFP-SD_STATSChipPAC.pdf

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Datasheet Details

Part number:

QFP-SD

Manufacturer:

STATS ChipPAC

File Size:

647.87 KB

Description:

Stacked Die Quad Flat Pack

Features

* Combining devices into one package reduces PCB real estate and cost
* Increased sub-system performance by integrating multiple chips into a single package
* Die to die bonding capability for device/signal integration
* Standard and green/lead-free materials and Pb-f

Applications

* Stacked Die QFP packages are currently available in LQFP, LQFP-ep and TQFP-ep configurations, and are offered in standard and green/lead-free bill of materials. APPLICATIONS Suitable for a variety of applications including memory integration (ASIC or Logic), chipset integration (Analog/ Digital),

QFP-SD Distributors

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📌 All Tags

QFP-SD Stacked Die Quad Flat Pack STATS ChipPAC

STATS ChipPAC QFP-SD-like datasheet

QFP-EP