Datasheet Summary
ACEPACK 2 power module, 3‑level topology, 1200 V, 13 mΩ typ. SiC Power MOSFET gen.2 with NTC
ACEPACK 2
S3 G3 D
DC+ T2
G1
T1
S1 AC
Features
- 3-level topology
- ACEPACK 2 power module
- 13 mΩ of typical RDS(on) each switch
- Insulation voltage UL certified of 2.5 kVrms
- Integrated NTC temperature sensor
- DBC Cu-Al2O3-Cu based
- Press fit contact pins
Applications
- DC/DC converter
G4
G2 S2 S4
Description
DC-
This ACEPACK 2 power module represents a leg of a T-type 3-level inverter
GADG240720201013GT topology that integrates the advanced silicon carbide Power MOSFET technology from STMicroelectronics. This module leverages the innovative properties of...