BUL741FP Overview
The devices are manufactured using high voltage multi-epitaxial planar technology for high switching speeds and high voltage capability. Thanks to an increased intermediate layer, it has an intrinsic ruggedness which enables the transistor to withstand an high collector current level during breakdown condition, without using the transil protection usually necessary in typical converters for lamp ballast. 3 2 1 TO-220FP Figure 1. Internal schematic diagram Table 1. Device summary Order codes Marking BUL741 BUL741 BUL741FP BUL741FP Packages TO-220 Contents BUL741, BUL741FP 1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2
BUL741FP Key Features
- High voltage capability
- Low spread of dynamic parameters
- Minimum lot-to-lot spread for reliable operation
- Very high switching speed
BUL741FP Applications
- Electronic ballast for fluorescent lighting
