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EMIF04-EAR02M8 - EMI Filtering & Signal Conditioning

General Description

The EMIF04-EAR02M8 chip is a highly integrated device designed to suppress EMI/RFI noise for headset mobile phone.

The new LC architecture on the speaker lines provides a high attenuation value maintaining a very low serial resistance.

Key Features

  • Lead-free package High attenuation: -30 dB at 900 MHz Low cut-off frequencies: 60 MHz for speaker lines High current capability: 50 mA per line Very low PCB space consumption: 1.5 mm x 1.7 mm Very thin package: 0.6 mm maximum High efficiency in ESD suppression IEC6 1000-4-2 level 4 High reliability offered by monolithic integration Figure 1. Pin configuration (bottom side) MIC_P_Int Micro QFN 8 leads MIC_P_Ext Complies with following standards:.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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EMIF04-EAR02M8 www.datasheet4u.com 4-line IPAD™ EMI filter and ESD protection for headset Features ■ ■ ■ ■ ■ ■ ■ ■ Lead-free package High attenuation: -30 dB at 900 MHz Low cut-off frequencies: 60 MHz for speaker lines High current capability: 50 mA per line Very low PCB space consumption: 1.5 mm x 1.7 mm Very thin package: 0.6 mm maximum High efficiency in ESD suppression IEC6 1000-4-2 level 4 High reliability offered by monolithic integration Figure 1. Pin configuration (bottom side) MIC_P_Int Micro QFN 8 leads MIC_P_Ext Complies with following standards: ■ EAR_Ext EAR_Ext GND MIC_N_Ext MIC_N_Int EAR_Int EAR_Int IEC 61000-4-2 level 4 input pins – 15 kV (air discharge) – 8 kV (contact discharge) Applications ■ Figure 2.