NAND01G-M
Key Features
- Multi-Chip Packages - 1 die of 256 Mb, 512 Mb (x8/ x16) NAND Flash + 1 die of 256 Mb (x16) SDR LPSDRAM - 1 die of 256 Mb, 512 Mb (x8/ x16) NAND Flash + 2 dice of 256 Mb (x16) SDR LPSDRAMs - 1 die of 256 Mb, 512 Mb (x8/ x16) NAND Flash +1 die of 256 Mb (x16) DDR LPSDRAM - 1 die of 512 Mb (x16) NAND Flash + 1 die of 256 Mb or 512 Mb (x16) DDR LPSDRAM Supply voltages - VDDF = 1.7V to 1.95V or 2.5V to 3.6V - VDDD = VDDQD = 1.7V to 1.9V Electronic Signature ECOPACK® packages Temperature range - -30 to 85°C FBGA
