K4B1G0446C - 1Gb C-die DDR3 SDRAM

Samsung semiconductor

K4B1G0446C Datasheet Preview — Preview of K4B1G0446C PDF

Datasheet Details

Part number	K4B1G0446C
Manufacturer	Samsung semiconductor
File Size	1.30 MB
Description	1Gb C-die DDR3 SDRAM
Datasheet	K4B1G0446C_Samsungsemiconductor.pdf

K4B1G0446C Product details

Description

11 5.0 DDR3 SDRAM Addressing 12 6.0 Absolute Maximum Ratings 14 6.1 Absolute Maximum DC Ratings 14 6.2 DRAM Component Operating Temperature Range 14 7.0 AC & DC Operating Conditions 14 7.1 Recommended DC operating Conditions (SSTL_1.5) 14 8.0 AC & DC Input Measurement Levels 15 8.1 AC and DC Logic input levels for single-ended signals 15 8.2 Differential swing requirement for differntial signals 16 8.2.1 Single-ended requirements for differential signals 17 8.3 AC and DC logic input levels for D

Features

4 3.0 Package pinout/Mechanical Dimension & Addressing 5 3.1 x4 Package Pinout (Top view) : 94ball FBGA Package(78balls + 16 balls of support balls) 5 3.2 x8 Package Pinout (Top view) : 94ball FBGA Package(78balls + 16 balls of support balls) 6 3.3 x16 Package Pinout (Top view) : 112ball FBGA Package(96balls + 16 balls of support balls) 7 3.4 FBGA Package Dimension (x4) 8 3.5 FBGA Package Dimension (x8) 9 3.6 FBGA Package Dimension (x16) 10 4.0 Input/Output Functional.

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Published: Mar 12, 2010 |