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K4S56163LF-XN - 4M x 16Bit x 4 Banks Mobile SDRAM

Download the K4S56163LF-XN datasheet PDF. This datasheet also covers the K4S56163LF-XE variant, as both devices belong to the same 4m x 16bit x 4 banks mobile sdram family and are provided as variant models within a single manufacturer datasheet.

Description

The K4S56163LF is 268,435,456 bits synchronous high data rate Dynamic RAM organized as 4 x 4,196,304 words by 16 bits, fabricated with SAMSUNG's high performance CMOS technology.

Features

  • 2.5V power supply.
  • LVCMOS compatible with multiplexed address.
  • Four banks operation.
  • MRS cycle with address key programs. -. CAS latency (1, 2 & 3). -. Burst length (1, 2, 4, 8 & Full page). -. Burst type (Sequential & Interleave).
  • EMRS cycle with address key programs.
  • All inputs are sampled at the positive going edge of the system clock.
  • Burst read single-bit write operation.
  • Special Function Support. -. PASR (Parti.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (K4S56163LF-XE_Samsungsemiconductor.pdf) that lists specifications for multiple related part numbers.

📁 Similar Datasheet

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K4S561632E-UC75 SDRAM 256Mb E-die Samsung
K4S561632H 256Mb H-Die SDRAM Samsung Electronics
K4S560432E-UC75 SDRAM 256Mb E-die Samsung

Other Datasheets by Samsung Semiconductor

Part Number Description
K4S56163LF-XC 4M x 16Bit x 4 Banks Mobile SDRAM
K4S56163LF-XE 4M x 16Bit x 4 Banks Mobile SDRAM
K4S56163LF-XF 4M x 16Bit x 4 Banks Mobile SDRAM
K4S56163LF-XG 4M x 16Bit x 4 Banks Mobile SDRAM
K4S56163LF-XL 4M x 16Bit x 4 Banks Mobile SDRAM

Full PDF Text Transcription

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K4S56163LF - X(Z)E/N/G/C/L/F 4M x 16Bit x 4 Banks Mobile SDRAM in 54BOC FEATURES • 2.5V power supply. • LVCMOS compatible with multiplexed address. • Four banks operation. • MRS cycle with address key programs. -. CAS latency (1, 2 & 3). -. Burst length (1, 2, 4, 8 & Full page). -. Burst type (Sequential & Interleave). • EMRS cycle with address key programs. • All inputs are sampled at the positive going edge of the system clock. • Burst read single-bit write operation. • Special Function Support. -. PASR (Partial Array Self Refresh). -. Internal TCSR (Temperature Compensated Self Refresh) • DQM for masking. • Auto refresh. • • • • 64ms refresh period (8K cycle). Commercial Temperature Operation (-25°C ~ 70°C). Extended Temperature Operation (-25°C ~ 85°C). 54Balls BOC with 0.
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