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STT3599C - MOSFET

General Description

These miniature surface mount MOSFETs utilize a high cell density trench process to provide low RDS(on) and to ensure minimal power loss and heat dissipation.

Key Features

  • Low RDS(on) provides higher efficiency and extends battery life.
  • Low thermal impedance copper leadframe TSOP-6 saves board space.
  • Fast switching speed.
  • High performance trench technology.

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Full PDF Text Transcription for STT3599C (Reference)

Note: Below is a high-fidelity text extraction (approx. 800 characters) for STT3599C. For precise diagrams, and layout, please refer to the original PDF.

Elektronische Bauelemente STT3599C (N-Ch) 3.7 A, 30 V, RDS(ON) 63 m (P-Ch) -2.7 A, -30 V, RDS(ON) 112 m N & P-Channel Enhancement Mode Mos.FET RoHS Compliant Product A ...

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12 m N & P-Channel Enhancement Mode Mos.FET RoHS Compliant Product A suffix of “-C” specifies halogen and lead-free DESCRIPTION These miniature surface mount MOSFETs utilize a high cell density trench process to provide low RDS(on) and to ensure minimal power loss and heat dissipation. Typical applications are DC-DC converters and power management in portable and battery-powered products such as computers, printers, PCMCIA cards, cellular and cordless telephones. TSOP-6 A E L B FEATURES  Low RDS(on) provides higher efficiency and extends battery life.  Low thermal impedance copper leadframe TSOP-6 saves board space.  F

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