STT3599C
DESCRIPTION
These miniature surface mount MOSFETs utilize a high cell density trench process to provide low RDS(on) and to ensure minimal power loss and heat dissipation. Typical applications are DC-DC converters and power management in portable and battery-powered products such as puters, printers, PCMCIA cards, cellular and cordless telephones.
TSOP-6
FEATURES
- Low RDS(on) provides higher efficiency and extends battery life.
- Low thermal impedance copper leadframe TSOP-6 saves board space.
- Fast switching speed.
- High performance trench technology.
PRODUCT SUMMARY
PRODUCT SUMMARY
VDS(V) 30
-30
RDS(on) ( 0.063@VGS= 10V 0.090@VGS= 4.5V 0.112@VGS= -10V 0.172@VGS= -4.5V
ID(A) 3.7 3.1 -2.7
-2.2
D1 S1 D2
65 4
Gate
Drain
F CH DG K J
REF.
A B C D E F
Millimeter
Min. Max.
2.70 3.10 2.60 3.00 1.40 1.80
1.10 MAX. 1.90 REF. 0.30 0.50
REF.
G H J K L
Millimeter
Min. Max.
0 0.10 0.60 REF. 0.12 REF. 0° 10° 0.95 REF.
-
Gate
Drain
123 G1 S2...
