The following content is an automatically extracted verbatim text
from the original manufacturer datasheet and is provided for reference purposes only.
View original datasheet text
Data Sheet No. 2C3960
Chip Type 2C3960 Geometry 0003 Polarity NPN
Generic Packaged Part:
2N3960
Chip type 2C3960 by Semicoa Semiconductors provides performance similar to these devices.
Part Numbers:
Product Summary: APPLICATIONS: Designed for high-speed current-mode logic switching. Features:
2N3960, 2N3960UB, SD3960F, SQ3960, SQ3960F
Mechanical Specifications
Metallization Bonding Pad Size Die Thickness Chip Area Top Surface Top Backside Emitter Base Al - 15 kÅ min. Au - 6.5 kÅ nom. 2.7 mils x 2.7 mils 2.7 mils x 2.7 mils 8 mils nominal 16 mils x 16 mils Silox Passivated
Electrical Characteristics
Parameter TA = 25oC Test conditions Min Max Unit
BVCEO IC = 10.0 mA 12 --V dc BVCBO IC = 10 µA 20 --V dc BVEBO IE = 10.0 mA 4.5 --V dc ICEX VCE = 10 V, VEB = 2.0 V --5.0 nA hFE1 IC = 1.