Datasheet Summary
SEMiX® 5
3-Level TNPC IGBT-Module
Features
- Solderless assembling solution with PressFIT signal pins and screw power terminals
- IGBT 4 Trench Gate Technology
- VCE(sat) with positive temperature coefficient
- Low inductance case
- Reliable mechanical design with injection moulded terminals and reliable internal connections
- UL recognized file no. E63532
- NTC temperature sensor inside
Remarks-
- Case temperature limited to TC=125°C max.
- Product reliability results are valid for Tjop=150°C
- IGBT1: outer IGBTs T1 & T4
- IGBT2: inner IGBTs T2 & T3
- Diode1: outer diodes D1 & D4
- Diode2: inner diodes D2 & D3
- For storage and case temperature...