PC817X8NSZ0F Datasheet (PDF) Download
Sharp Corporation
PC817X8NSZ0F

Description

PC817XNNSZ0F Series contains an IRED optically coupled to a phototransistor. It is packaged in a 4-pin DIP.

Key Features

  • 4-pin DIP package
  • Double transfer mold package (Ideal for Flow Soldering)
  • High isolation voltage between input and output (Viso(rms) : 5kV)
  • High collector-emitter voltage(VCEO : 80V)
  • Current transfer ratio (CTR : MIN. 50% at IF=5 mA, VCE=5V)
  • RoHS directive compliant