TZM5228B - (TZM5221B - TZM5267B) 500mW Surface Mount Zener Diodes
TAITRON Components Incorporated
Download the TZM5228B datasheet PDF.
This datasheet also covers the TZM5229B variant, as both devices belong to the same (tzm5221b - tzm5267b) 500mw surface mount zener diodes family and are provided as variant models within a single manufacturer datasheet.
General Description
Power Dissipation at Ta=25° C Forward Voltage Thermal Resistance Junction to Ambient Junction Temperature Storage Temperature Range Value 500 1.1 0.3 175 -65 to +175 Unit mW V K/mW °C °C Conditions
PD VF RthJA TJ TSTG
IF=200mA
Note: Valid provided that leads at a distance of 10mm from case are ke
Key Features
Planar Die Construction 500mW Power Dissipation Very Sharp Reverse Characteristic Very High Stability Low Reverse Current Level Standard Zener Voltage Tolerance is ± 5 % Ideally Suited for Automated Assembly Processes RoHS Compliant
MiniMelf
Mechanical Data
Case: Terminals: Polarity: Weight: Molded Glass MiniMelf Solderable per MIL-STD-202E, Method 208 Color band denotes cathode end Approx. 0.03 grams
Maximum Rati.
Note: The manufacturer provides a single datasheet file (TZM5229B_TAITRONComponentsIncorporated.pdf) that lists specifications for multiple related part numbers.
Datasheet Details
Part number
TZM5228B
Manufacturer
TAITRON Components Incorporated
File Size
226.20 KB
Description
(TZM5221B - TZM5267B) 500mW Surface Mount Zener Diodes
Full PDF Text Transcription for TZM5228B (Reference)
Note: Below is a high-fidelity text extraction (approx. 800 characters) for
TZM5228B. For precise diagrams, and layout, please refer to the original PDF.
www.DataSheet4U.com 500mW Surface Mount Zener Diodes TZM5221B - TZM5267B 500mW Surface Mount Zener Diodes Features • • • • • • • • Planar Die Construction 500mW Power Dis...
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iodes Features • • • • • • • • Planar Die Construction 500mW Power Dissipation Very Sharp Reverse Characteristic Very High Stability Low Reverse Current Level Standard Zener Voltage Tolerance is ± 5 % Ideally Suited for Automated Assembly Processes RoHS Compliant MiniMelf Mechanical Data Case: Terminals: Polarity: Weight: Molded Glass MiniMelf Solderable per MIL-STD-202E, Method 208 Color band denotes cathode end Approx. 0.03 grams Maximum Ratings & Electrical Characteristics (T Ambient=25ºC unless noted otherwise) Symbol Description Power Dissipation at Ta=25° C Forward Voltage Thermal Resistance Junction to Ambient Junct